Cadence SSV Release Version 22.11.100 (Linux)
Cadence SSV Release Version 22.11.100 (Linux) Downloadly IRSpace
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The Cadence Silicon Signoff and Verification (SSV) Release is a suite of tools designed to enhance digital design and verification processes. Semiconductor device performance degrades over time due to various physical phenomena, such as Bias Temperature Instability (BTI), Hot Carrier Injection (HCI), and process node/device failures. The major factors responsible for device degradation are stress duration, temperature, supply voltage, and logic conditions. Traditionally, timing margins are used for accounting for aging-related timing degradation. The Tempus advanced aging-aware timing analysis addresses aging-related effects accurately, minimizes margins, and improves the PPA (power, performance, and area) of a design. An increase in the number of power domains in a design has become a challenging aspect for designers. This has resulted in a significant increase in the number of timing signoff corners due to cross combinations of voltage corners. This also leads to long cycle times and large compute requirements for timing signoff.
To reduce the cycle time and computation requirements, Tempus provides the new capability to run inter-power domain (IPD) analysis, where only IPD logic in the design will be analyzed, and the timing reports will generate data for the relevant IPD logic only. The reduced capacity requirement per IPD run helps to analyze the IPD logic of the design efficiently. The statistical via variation feature allows you to define the sensitivity of via resistance as a function of area. Tempus computes the interconnect variation based on statistical via resistance. To support the via variation flow, additional data for modeling via variation is required. This includes via variation side file that contains look-up tables of via resistance statistical data and the extend SPEF file that contains via resistance layer and area information. Tempus timing reports show interconnect variation in the results when via variation is enabled.
Features of LibRaw FastRawViewer
- Support for localized disk data caching to retrieve information quickly and speed up the processing time
- Enhanced capacity for die-model generation by using the advanced Model Order Reduction (MOR) techniques
- Improved the method for fracturing Non-Manhattan shapes, enabling current-aware modeling of the shapes
- Enhanced algorithm for hierarchical net-tracing in designs with many hierarchies
System Requirements
Linux
Picture
Installation Guide
Check out Readme.txt file in Crack folder
Download Links
File size
23.1 GB
